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AN814
Vishay Siliconix
SC-70 (6-PIN)
500
R q JA
P D + 150 C o * 25 C
R q JA
P D + 150 C o * 60 C
Room Ambient 25 _ C
T J(max) * T A
P D +
o o
400 C W
P D + 312 mW
Elevated Ambient 60 _ C
T J(max) * T A
P D +
o o
400 C W
P D + 225 mW
400
300
200
Dual EVB
NOTE: Although they are intended for low-power applications,
devices in the 6-pin SC-70 will handle power dissipation in
excess of 0.2 W.
100
0
1” Square FR4 PCB
Testing
10 -5 10 -4
10 -3
10 -2 10 -1
Time (Secs)
1
10
100
1000
To aid comparison further, Figure 2 illustrates the dual-channel
SC-70 thermal performance on two different board sizes and
two different pad patterns. The results display the thermal
performance out to steady state. The measured steady state
values of R θ JA for the dual 6-pin SC-70 are as follows:
LITTLE FOOT SC-70 (6-PIN )
FIGURE 2. Comparison of Dual SC70-6 on EVB and 1”
Square FR4 PCB.
The results show that if the board area can be increased and
maximum copper traces are added, the thermal resistance
reduction is limited to 20%. This fact confirms that the power
dissipation is restricted with the package size and the Alloy 42
leadframe.
1) Minimum recommended pad pattern (see
Figure 2) on the EVB of 0.5 inches x
0.6 inches.
2) Industry standard 1” square PCB with
maximum copper both sides.
www.vishay.com
2
518 _ C/W
413 _ C/W
ASSOCIATED DOCUMENT
Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET Copper
Leadframe Version, REcommended Pad Pattern and Thermal
Performance, AN815, (http://www.vishay.com/doc?71334) .
Document Number: 71237
12-Dec-03
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